Heatsinks & Thermal Management

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Transducer Function Power Rating No. of Stages Cooling Power Pc Current Max @ Diff Temperature Max Voltage Max @ Diff Temperature Max Length Width Depth Temperature Difference Max Product Range Internal Resistance Lead Wires
 
 
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MCPE-031-10-13
MCPE-031-10-13 - Peltier Cooler, 8.8W

SC10911

Peltier Cooler, 8.8W

MULTICOMP PRO

• PE series, max operating temperature for short term 110℃, recommended max 90℃ for long lifetime • Good reliability in ON-OFF power cycling mode • Recommended operating current 0.7 Imax for long life • Multicomp products are rated 4.6 out of 5 stars • 12...

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Thermoelectric Cooler 8.8W 1 Stage 8.8W 3.9A 3.8VDC 15mm 15mm 3.6mm 74°C MCPE 0.95ohm UL-Style 1569, Unstripped
TV40G
TV40G - Heat Sink, PCB, Board Level, 9.9 °C/W, TO-218, TO-220, 28 mm, 22 mm, 38 mm

SC10806

Heat Sink, PCB, Board Level, 9.9 °C/W, TO-218, TO-220, 28 mm, 22 mm, 38 mm

BOYD

TV40G is a 22 x 38 x 28mm narrow channel-style heat sink with twisted fins. This narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO-220 devices. • Thick aluminium ...

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890SP-02000-A-100
890SP-02000-A-100 - Heat Sink, Ultra-Fin™, 0.07 °C/W, 101.6 mm, 32 mm, 200 mm

SC10900

Heat Sink, Ultra-Fin™, 0.07 °C/W, 101.6 mm, 32 mm, 200 mm

H S MARSTON

• Latest generation extrusion technology • Exceptional fin height/space ratio • Increased thermal performance from a lower mass • Optimum performance achieved when force air cooled • 0.07°C/W

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MPC151525T
MPC151525T - Heat Sink, Square, Micro Porous, 10.21 °C/W, 15 mm, 2.5 mm, 15 mm

SC14048

Heat Sink, Square, Micro Porous, 10.21 °C/W, 15 mm, 2.5 mm, 15 mm

AMEC THERMASOL

The MPC151525T is a 15x15x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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1+ €1.2995 (€1.60) 10+ €1.0622 (€1.31) 100+ €0.8136 (€1.00) 250+ €0.7006 (€0.86)

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KM75-1
KM75-1 - Heat Sink, TO-220/218, 3.7 °C/W, TO-218, TO-220, 75 mm, 45 mm, 75 mm

SC10864

Heat Sink, TO-220/218, 3.7 °C/W, TO-218, TO-220, 75 mm, 45 mm, 75 mm

BOYD

This heatsink features a clip retaining slot and is for use with retaining clips for quick and easy fitting.

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MPC101020T
MPC101020T - Heat Sink, Square, Micro Porous Ceramic, Adhesive Tape, 10.21 °C/W, 10 mm, 2.01 mm, 10 mm

SC14047

Heat Sink, Square, Micro Porous Ceramic, Adhesive Tape, 10.21 °C/W, 10 mm, 2.01 mm, 10 mm

AMEC THERMASOL

The MPC101020T is a 10x10x2.0mm low-profile, light-weight, flat Micro-Porous Ceramic Heat Sink (MPCHS). Due to its highly micro-porous nature it provides a very large surface area compared to conventional copper/aluminium heatsinks and therefore provides e...

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PF720
PF720 - Heat Sink, TO-220, 28 °C/W, TO-220, 19.7 mm, 20 mm, 8.1 mm

SC10793

Heat Sink, TO-220, 28 °C/W, TO-220, 19.7 mm, 20 mm, 8.1 mm

BOYD

The PF720 is a clip-on Heat Sink made of black pre-painted aluminium suitable for TO-220 packages. It is designed for use without thermal interface grease.

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ICK 40 B
ICK 40 B - Heatsink, DIP, Glue-On, 46°C/W

SC10787

Heatsink, DIP, Glue-On, 46°C/W

FISCHER ELEKTRONIK

The ICK 40B from Fischer Elektronik is a suitable for cooling ICs in a DIl housing of 14 to 40 pins. • Pin count: 40

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ICK 14/16 L
ICK 14/16 L - Heat Sink, DIP, Glue-On, 46 °C/W, DIP, 6.3 mm, 4.8 mm, 19 mm

SC10785

Heat Sink, DIP, Glue-On, 46 °C/W, DIP, 6.3 mm, 4.8 mm, 19 mm

FISCHER ELEKTRONIK

• Pin count: 14/ 16

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ICK 14/16 B
ICK 14/16 B - Heat Sink, DIP, Glue-On, 50 °C/W, DIP, 19 mm, 4.8 mm, 6.3 mm

SC10788

Heat Sink, DIP, Glue-On, 50 °C/W, DIP, 19 mm, 4.8 mm, 6.3 mm

FISCHER ELEKTRONIK

• Pin count: 14/ 16

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1.25GY-50
1.25GY-50 - Heat Sink, TO-220, 6.8 °C/W, TO-220, 32 mm, 16 mm, 60 mm

SC10807

Heat Sink, TO-220, 6.8 °C/W, TO-220, 32 mm, 16 mm, 60 mm

BOYD

The 1.25GY-50 from Aavid Thermalloy is a heatsink in TO220 package. • Mountable in both vertical and horizontal mode • Central groove prevents device rotation • Black anodised finish • Thermal resistance of 6.8°C/W(Horizontal) and 8.6°C/W(vertical) • Exter...

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PPN1000B
PPN1000B - Heat Sink, TO-218, TO-220, 3.1 °C/W, TO-218, TO-220, 50 mm, 28 mm, 100 mm

SC10878

Heat Sink, TO-218, TO-220, 3.1 °C/W, TO-218, TO-220, 50 mm, 28 mm, 100 mm

ABL HEATSINKS

A simple, reliable and convenient alternative to screw attachment. The heatsinks also include slots to allow the option of screw connections.

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THER-T-LARGE
THER-T-LARGE - Thermal Insulator, Thermaflex Tube, TO-3P, Silicone Extrusion, 0.7 W/m.K, 8 kV, 0.5 mm

SC10752

Thermal Insulator, Thermaflex Tube, TO-3P, Silicone Extrusion, 0.7 W/m.K, 8 kV, 0.5 mm

LAIRD

A simple and safe method of isolating power devices. The transistor is inserted into the flexible tube, which is then clipped on to a suitable heatsink. Electrical isolation is greatly improved compared to traditional screw mounting techniques. UL recogn...

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FK 240 SA 220 V
FK 240 SA 220 V - Heatsink, TO220

SC10859

Heatsink, TO220

FISCHER ELEKTRONIK

• Vertical mounting with soldering lug • Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly

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L375-150-1.0A
L375-150-1.0A - Gap Filler, 1mm Sheet

SC10699

Gap Filler, 1mm Sheet

T GLOBAL

• Soft material highly compressible, easy to assemble, and provide good electrical insulation • Shock and vibration absorber • Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction • Dissipates heat from LEDs, mo...

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K6-104
K6-104 - Thermal Insulator, Sil-Pad K-6, .006

SC10726

Thermal Insulator, Sil-Pad K-6, .006", TO-3P, Silicone Elastomer, 1.1 W/m.K, 6 kV, 0.152 mm

BERGQUIST

Sil-Pad K-6 is a medium performance film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provides a continuous, physically tough, dielectric barrier against ‘cut-through ’and resultant asse...

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647-10-ABPE
647-10-ABPE - Heat Sink, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

SC10905

Heat Sink, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

WAKEFIELD THERMAL

• High thermal efficiency • Space-saving, vertical mounting • Wave solderable pins on 25.4mm centres • Black anodised

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MQ50-1
MQ50-1 - Heat Sink, Undrilled, 11 °C/W, TO-218, TO-220, 29.5 mm, 11 mm, 50 mm

SC12545

Heat Sink, Undrilled, 11 °C/W, TO-218, TO-220, 29.5 mm, 11 mm, 50 mm

BOYD

The MQ50-1 is a 50 x 29.5 x 11mm undrilled power Heat Sink made of aluminium with black anodized finish. This heat sink is suitable for use with TO-218 and TO-220 devices.

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SK 145/37,5 STS-220
SK 145/37,5 STS-220 - Heatsink, TO220, Etc, 12°C/W

SC10897

Heatsink, TO220, Etc, 12°C/W

FISCHER ELEKTRONIK

The SK 145/37,5 STS-220 from Fisher Elektronik is an extruded heatsink with solder pins for PCB mounting. Heatsink dimension is 37.5mm x 29mm x 12mm (L x W x H). • Suitable for TO-218, TO-220, TO-247, TO-248 packages • Features screw mounting • Thermal res...

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FK 237 SA 220 O
FK 237 SA 220 O - Heat Sink, Square, PCB, Clip On, 21 °C/W, TO-220, 14.5 mm, 12.7 mm, 19 mm

SC10853

Heat Sink, Square, PCB, Clip On, 21 °C/W, TO-220, 14.5 mm, 12.7 mm, 19 mm

FISCHER ELEKTRONIK

• Small version with improved thermal resistance • Uses less PCB space than other heatsinks • Easy assembly

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GP2000S40-0.125-02-4/4
GP2000S40-0.125-02-4/4 - Thermal Insulator, Gap Pad 2000S40, .125

SC10747

Thermal Insulator, Gap Pad 2000S40, .125", 4" x 4" Sheet, Fibreglass, 2 W/m.K, 2.5 kV, 3.18 mm

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is ideal for situations where you require high thermal performance and a pad th...

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150AB1500MB
150AB1500MB - Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 150 mm

SC10892

Heat Sink, T Slots, 1.1 °C/W, 96 mm, 40 mm, 150 mm

ABL HEATSINKS

The 150AB1500MB is a T-slots Heat Sink made of aluminium.

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3223-07FR-43
3223-07FR-43 - Thermal Pad, Silicone, Fibreglass, 0.178 mm, 0.9 W/m.K

SC10727

Thermal Pad, Silicone, Fibreglass, 0.178 mm, 0.9 W/m.K

BERGQUIST

The 3223-07FR-43 from Bergquist is a fibreglass based silicone pad. • Suitable for clip mounted TO-220 packages, or screw mounted TO-220 • Clean, grease-free and flexible • 0.45°C/W thermal resistance • Electrically isolating to 3.5kV (min) • Silicon rubbe...

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GAP PAD 0.125" SHEET 100MMX100MM
GAP PAD 0.125

SC10740

Gap Pad, 0.125", 100mm x 100mm Sheet

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. • Eliminates air gaps to reduce thermal resistance • Highly conformable to reduce in...

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BG405792
BG405792 - Gap Pad, Thermally Conductive Interface, Sheet, 0.8 W/m.K, 1.52  mm Thickness

SC10734

Gap Pad, Thermally Conductive Interface, Sheet, 0.8 W/m.K, 1.52 mm Thickness

BERGQUIST

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This sheet is ideal for low stress applications and fragile components. • Eliminates...

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