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No-Clean Lead-Free Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T3 Mesh, 50g -
SMD291SNL50T3
- Manufacturer:
- CHIP QUIK CHIP QUIK
- Manufacturer Part No:
- SMD291SNL50T3
- Order Code:
- SD02703
- Technical Datasheet:
- SMD291SNL50T3 Datasheet
Product Overview
No-clean, lead-free solder paste in 50g jar.
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Passes BONO test @ 1.56%
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
Product Information
- :
- Synthetic No Clean
- :
- 96.5, 3, 0.5 Sn, Ag, Cu
- :
- 220°C
- :
- 50g
- :
- 1.76oz
- :
- -
Technical Documents (2)
Available for back order
More stock available to supplier lead times which is approximately 19/06/23
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4
You can reserve stock now just order your desired quantity and checkout as normal. The quantity that cant be dispatched now will be placed on back order and sent as soon as we get a delivery from our supplier. You only get charged when the products are dispatched to you.
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€15.9556
(
€19.63
Inc. VAT)
Pricing is unavailable. Please contact customer services.
- Price for:
- Each
Multiple: 1 Minimum: 1
- 1+
- 3+
| Quantity | Price | Your Price |
|---|---|---|
| 1+ | €15.9556 (€19.63) | ( ) |
| 3+ | €15.6505 (€19.25) | ( ) |
| Quantity | Price | Your Price |
|---|
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