Solder Paste

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SAC305 862 4 89%
SAC305 862 4 89% - SOLDER PASTE, LEAD FREE, 862, 250G

SD02121

SOLDER PASTE, LEAD FREE, 862, 250G

QUALITEK

• Lead-free Solder paste for printing • Popular lead-free alloy for SMT • No clean flux • Broad process window • Post Soldering residues are transparent, non-corrosive and non-conductive • MESH Type 3 • Handy 250g pot • Melting temperature: 217°C - 219°C

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1+ €53.3715 (€65.65) 5+ €48.5185 (€59.68)

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- 95.5, 3, 0.5 Sn, Ag, Cu 217°C 250g 0.55lb -
SN62 818 4 90%, 250G TUB
SN62 818 4 90%, 250G TUB - SOLDER PASTE, 818, SN62, 250GM

SD01925

SOLDER PASTE, 818, SN62, 250GM

QUALITEK

Low residue No-Clean solder paste designed for surface mount and other electronic assembly applications. The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post...

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- 62, 36, 2 Sn, Pb, Ag 125°C 250g 8.818oz -
MICROPRINT P2010, 25-45UM, 40G
MICROPRINT P2010, 25-45UM, 40G - SOLDER PASTE, 25-45UM, 40G SYRINGE

SD02801

SOLDER PASTE, 25-45UM, 40G SYRINGE

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 40g 1.41oz Warton Metals - Microprint P2010 Solder Paste
SAC305 618D 4 85%, 25G INC PLUNGER
SAC305 618D 4 85%, 25G INC PLUNGER - SOLDER PASTE, 618D, SAC305, 25GM

SD01926

SOLDER PASTE, 618D, SAC305, 25GM

QUALITEK

Lead free solder paste which exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues are non-conductive, non-corrosive and highly insulated. • Low residues • Easily dispensed • Long...

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No Clean 95, 5, 0.7 Sn, Ag, Cu 217°C 25g 0.882oz -
SN62 619D 4 86%, 35G INC PLUNGER
SN62 619D 4 86%, 35G INC PLUNGER - SOLDER PASTE, 619D, SN62, 35GM

SD01924

SOLDER PASTE, 619D, SN62, 35GM

QUALITEK

No-clean solder paste designed for surface mount applications using a syringe dispensing method. • Transparent, soft, non-conductive, pin testable post solder residue • Excellent wettability • Supplied in a 10cc Syringe with plunger

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No Clean 63, 37 Sn, Pb 183°C 35g 1.235oz -
SMD4300AX10
SMD4300AX10 - Solder Paste, Water Washable, 183 °C, 35 g

SD01438

Solder Paste, Water Washable, 183 °C, 35 g

CHIP QUIK

• Supplied in 10cc syringe • Water washable

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No Clean 63, 37 Sn, Pb 183°C 35g 1.235oz -
SMD291AX10
SMD291AX10 - Solder Paste, No-Clean, 183 °C, 35 g

SD01437

Solder Paste, No-Clean, 183 °C, 35 g

CHIP QUIK

No-clean solder paste in syringe applicator with plunger and tip. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatib...

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No Clean 63, 37 Sn, Pb 183°C 35g 1.235oz Chip Quik - No-Clean Solder Paste
SMD291SNL60T4
SMD291SNL60T4 - Solder Paste, No Clean, 2 Part, Bag, 217 °C, 60 g

SD02053

Solder Paste, No Clean, 2 Part, Bag, 217 °C, 60 g

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix

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1+ €41.3425 (€50.85) 5+ €38.6745 (€47.57)

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 60g 2.116oz -
SMDLTLFP15T4
SMDLTLFP15T4 - Solder Paste, No Clean, 2 Part, Jar, 138 °C, 15 g

SD02050

Solder Paste, No Clean, 2 Part, Jar, 138 °C, 15 g

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 15g 0.529oz -
SMDLTLFP60T4
SMDLTLFP60T4 - Solder Paste, No Clean, 2 Part, Bag, 138 °C, 60 g

SD02051

Solder Paste, No Clean, 2 Part, Bag, 138 °C, 60 g

CHIP QUIK

• No-Clean and Lead-Free • Flux Type: Synthetic No-Clean • Flux Classification: REL0 • Metal Content: 87% Metal by weight • Particle Size: T4 (20-38 microns) • Two part mix • Shelf life: 2-years unrefrigerated (before mixed), <gt/>6-months refrigerated/<g...

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No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 60g 2.116oz -
SMD291SNL50T3
SMD291SNL50T3 - Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 50G

SD02703

Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 50G

CHIP QUIK

No-clean, lead-free solder paste in 50g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed prin...

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1+ €16.675 (€20.51) 3+ €16.353 (€20.11)

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 50g 1.76oz -
D01851
D01851 - SOLDERING FLUX PASTE, 30G

SD01704

SOLDERING FLUX PASTE, 30G

DURATOOL

D01851 is 30g soldering flux paste. • 48°C melting temperature

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1+ €1.38 (€1.70) 10+ €1.0925 (€1.34)

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- - 48°C 30g 1.058oz D0185x
GC 10 SAC305T3 885V 52K 500G
GC 10 SAC305T3 885V 52K 500G - Solder Paste, No Clean, Tub, 217 °C, 500 g

SD02341

Solder Paste, No Clean, Tub, 217 °C, 500 g

LOCTITE

The LOCTITE GC10 SAC305T3 885V 52K is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel for...

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1+ €101.1425 (€124.41) 3+ €93.2995 (€114.76)

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 500g 1.102lb -
RM 92 SN62AAS90 AK
RM 92 SN62AAS90 AK - RM92 No-Clean RMA Solder Cream for Stencilling 500g Tub

SD00042

RM92 No-Clean RMA Solder Cream for Stencilling 500g Tub

MULTICORE / LOCTITE

• Excellent tack life • High activity to deal with poor component solderablity • Produces safe residues – eliminates the need for cleaning • Supplied in a tub

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- 62, 36, 2 Sn, Pb, Cu - 500g 1.102lb -
SMD16
SMD16 - SMD 16 16FT INDUSTRIAL PACK

SD00633

SMD 16 16FT INDUSTRIAL PACK

CHIP QUIK

Replacement alloy for removing SMDs • The same alloy included with the Chip Quick Removal Kit • Instructions included

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1+ €86.1925 (€106.02) 3+ €82.225 (€101.14)

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- 12, 18, 49, 21, Sn, Pb, Bi, In 58°C - - -
D01850
D01850 - SOLDER PASTE, 10G

SD01703

SOLDER PASTE, 10G

DURATOOL

• 80% Petroleum Jelly / 20% ZnCl<sub>2</sub>

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- - 48°C 10g 0.353oz D0185x
SMD4300SNL10
SMD4300SNL10 - Solder Paste, Water Washable, 217 °C, 35 g

SD01440

Solder Paste, Water Washable, 217 °C, 35 g

CHIP QUIK

• Supplied in 10cc syringe • Lead free • Water washable

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 217°C 35g 1.235oz -
MICROPRINT P2010 25-38UM, 40G
MICROPRINT P2010 25-38UM, 40G - SOLDER PASTE, 25-38UM, 40G SYRINGE

SD02803

SOLDER PASTE, 25-38UM, 40G SYRINGE

WARTON

Microprint P2010 is a no clean, lead-free solder paste for air and nitrogen reflow. It has been developed to work well at higher processing temperatures as required by the SAC alloys. Suitable for a variety of substrate materials including Sn/Pb, Au/Ni and...

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No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 40g 1.41oz Warton Metals - Microprint P2010 Solder Paste
TS391SNL
TS391SNL - Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 15G

SD02708

Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 15G

CHIP QUIK

No-clean, lead-free, thermally stable solder paste in syringe applicator with plunger and tip. • Printing speeds up to 125mm/sec. • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finish...

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 15g 0.53oz -
NEXUS NXG-909 SMALL REWORK PACK
NEXUS NXG-909 SMALL REWORK PACK - REWORK PACK, SMALL, 10G

SD02787

REWORK PACK, SMALL, 10G

WARTON

Halide-free and halogen-free, clear residue rework gel for the rework of SMT and conventional through-hole devices. • Developed for excellent performance on all lead-free finishes • Exceeds the requirements of J-STD-004B type ROL0 • Powerful wetting on all...

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Halogen Free - - 10g 0.35oz Warton Metals - Nexus Rework Gel
SMD291SNL250T3
SMD291SNL250T3 - Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 250G

SD02702

Solder Paste, Synthetic No Clean, 220 °C, 96.5, 3, 0.5 Sn, Ag, Cu, 250G

CHIP QUIK

No-clean, lead-free solder paste in 250g jar. • Printing speeds up to 100mm/sec • Long stencil life • Wide process window • Clear residue • Low voiding • Excellent wetting compatibility on most board finishes • Dispense grade • Compatible with enclosed pri...

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Synthetic No Clean 96.5, 3, 0.5 Sn, Ag, Cu 220°C 250g 8.82oz -
NEXUS NXG-909 LARGE REWORK PACK 30G
NEXUS NXG-909 LARGE REWORK PACK 30G - REWORK PACK, LARGE, 30G

SD02788

REWORK PACK, LARGE, 30G

WARTON

Halide-free and halogen-free, clear residue rework gel for the rework of SMT and conventional through-hole devices. • Developed for excellent performance on all lead-free finishes • Exceeds the requirements of J-STD-004B type ROL0 • Powerful wetting on all...

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Halogen Free - - 30g 1.06oz Warton Metals - Nexus Rework Gel
SMDLTLFP10T5
SMDLTLFP10T5 - Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 35G

SD02704

Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 35G

CHIP QUIK

No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. • Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components • Printing speeds up to 100mm/sec • Long stencil life • Wid...

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Synthetic No Clean 42, 57.6, 0.4 Sn, Bi, Ag 138°C 35g 1.23oz -
CR11
CR11 - Solder Paste, Syringe, 138 °C

SD03036

Solder Paste, Syringe, 138 °C

EDSYN

CR 11 is a lead free solder paste for all SMD applications. Not to be mixed with leaded material • Lead-free no clean Paste • Easy soldering of lead-free soldering joints when compared to lead-free soldering wire • No globule or spatter formation • Excelle...

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No Clean 58, 42 Bi, Sn 138°C - - -
CR 88
CR 88 - Solder Paste, Syringe, 221 °C, 10 g

SD03035

Solder Paste, Syringe, 221 °C, 10 g

EDSYN

The CR 88 from Edsyn is a solder paste. It is a predicted high-tech product with excellent suitability for all SMD application. CR88 solder paste is easy of application and user friendly for time saving soldering of SOP, QFP and PLCC packages. • Meets the ...

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No Clean 96.5, 3.5 Sn, Ag 221°C 10g 0.353oz -