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No-Clean, Lead-Free, Low Temperature, Thermally Stable Solder Paste Jar, Sn42/Bi57.6/Ag0.4, T4 Mesh, 50g -
TS391LT50
- Manufacturer:
- CHIP QUIK CHIP QUIK
- Manufacturer Part No:
- TS391LT50
- Order Code:
- SD02707
- Technical Datasheet:
- TS391LT50 Datasheet
Product Overview
No-clean, lead-free, low temperature thermally stable solder paste in 50g jar.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- No refrigeration required
- Alloy: Sn42/Bi57.6/Ag0.4
Product Information
- :
- Synthetic No Clean
- :
- 42, 57.6, 0.4 Sn, Bi, Ag
- :
- 138°C
- :
- 50g
- :
- 1.76oz
- :
- -
Technical Documents (2)
6 In stock
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You can reserve stock now just order your desired quantity and checkout as normal. The quantity that cant be dispatched now will be placed on back order and sent as soon as we get a delivery from our supplier. You only get charged when the products are dispatched to you.
8 more will be available on 21/06/23
Extra stock is available upon order to the Supplier Lead Time which is approximately 19/06/23
×
Order before 3pm
Monday to Friday excluding National Holidays
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€20.5095
(
€25.23
Inc. VAT)
Pricing is unavailable. Please contact customer services.
- Price for:
- Each
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| Quantity | Price | Your Price |
|---|---|---|
| 1+ | €20.5095 (€25.23) | ( ) |
| 3+ | €19.775 (€24.32) | ( ) |
| Quantity | Price | Your Price |
|---|
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