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No-Clean, Lead-Free, Thermally Stable Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T4 Mesh, 50g - 

TS391SNL50

TS391SNL50 - No-Clean, Lead-Free, Thermally Stable Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T4 Mesh, 50g

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Manufacturer:
CHIP QUIK CHIP QUIK
Manufacturer Part No:
TS391SNL50
Order Code:
SD02709
Technical Datasheet:
TS391SNL50   Datasheet
See all Technical Docs

Product Overview

No-clean, lead-free, thermally stable solder paste in 50g jar.
  • Printing speeds up to 125mm/sec.
  • Long stencil life
  • Wide process window
  • Clear residue
  • Low voiding
  • Excellent wetting compatibility on most board finishes
  • Dispense grade
  • Compatible with enclosed print heads
  • T4 mesh
  • No refrigeration required
  • Alloy: Sn96/Ag3/Cu0.5

Product Information


:
Synthetic No Clean

:
96.5, 3, 0.5 Sn, Ag, Cu

:
220°C

:
50g

:
1.76oz

:
-

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Technical Docs (2)

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€14.9176 ( €18.35  Inc. VAT)

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